CCI Eurolam - Partner of the European PCB Industry

Basematerial

Rigid, Multilayer and Prepreg-Material, Epoxy, High-Tg, Halogene-Free, Thermally Stable, CAF-Resistant

For High-Temperature-Applications Multilayer, Prepreg, No-Flow and Resin-Filler


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Epoxy- and Polyimide Resin-Systems with Thermount®, Kevlar®, Quartz and CIC

Microwave-Products based on PTFE or non-PTFE, with woven and non-woven Fiberglass and Ceramic-filled

No-Flow Prepregs for Rigid-Flex and Heat-Sink applications Epoxy, High-Tg, Polyimide

Flex

Pyralux^® and Nikaflex^® Flexible Laminates, Coverlay, Adhesive and Bondply Adhesiveless, Acrylic and Epoxy-Adhesive

Products for Thermal Management as heat-distributing basematerial based on CML-6 or FR-4 prepreg with an Aluminium carrier.

CEM-1, Black FR-4
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