Kupfer-Invar-Kupfer-Folien (CIC) werden für Leiterplatten mit engen Toleranzen verwendet, eingebettete Masselagen, niedrige thermische Ausdehnung und Heat-Sink Anwendungen.
OhmegaPly® is a thin film Electrodeposited-On-Copper NiP metal alloy (RESISTOR-CONDUCTOR MATERIAL) that is laminated to a dielectric material and subtractively processed to produce planar resistors. Because of its thin film nature, it can be buried within layers without increasing the thickness of the board or occupying any surface space like discrete resistors.
