High performance coated foils for HDI applications
Zeta® Cap
High Performance C-Stage polymer coated copper foil
High Tg (>300°C), low CTE, fully cured and filled po lyimide based dielectric
Used with standard prepregs or Zeta® Bond
Solves pad cratering issues
Zeta® Bond SE
Hi Tg “B” stage glass free epoxy based bonding film
Thickness is easily tailored to fill areas around plated circuits and plated holes
Hi peels, even after multiple lamination cycles
· New epoxy technology for multiple lam cycles
- Non-dicy
- Non-phenolic
- 10x laminations without degradation
- Halogen free
· High Tg (180°C)and High Td (400°C)
· High flow and fill rate
· Low moisture absorbing
· Excellent thermal performance
Zeta® Lam
Zeta® Cap + Zeta® Bond
Ready to use in Lay-up without prepreg
· Complete HDI material package with copper
· C-stage layer provides a polymer solution to fiberglass;
- Very high dielectric strength
- Lower Z-axis CTE than other glass free dielectrics materials, lower Dk (3.4), lower loss, less transmission line variation (no glass bundles)
- High copper peels at high temperatures
· B-stage layer provides;
- Bonding and fill of circuits and vias (various thicknesses of resins are available for fill requirements)
- Curable with standard PCB laminating equipment @190°C
