| Rigid, Multilayer and Prepreg-Material, Epoxy, High-Tg, Halogene-Free, Thermally Stable, CAF-Resistant |  |
| Reference |
Tg (DSC) |
Description |
PDF |
| Lead-Free compatible |
| DE104i |
> 130 °C |
Rigid FR-4 laminate, resisting for more than 60 minutes to delamination test at 260 °C, Compatible with the new lead free processes. |
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| IS400 |
> 145 °C |
FR-4 laminate with a Tg of approximately 150 °C which can go through many VRT. Low z-axis expansion. CAF-resistant. T260 > 60 min., Compatible with the new lead free processes. |
|
| IS410 |
≈ 180 °C |
High-Tg FR-4 laminate and prepreg with a Tg of 170 - 180 °C (DSC). Offers very high heat-resistance (8 pass at 288 °C) and chemical attack, CAF-resistant, Compatible with the new lead free processes. |
|
| IS420 |
≈ 180°C |
High-Tg FR-4 laminate and prepreg with a Tg of 170 - 180 °C (DSC). Offers very high resistance to heat (8 pass at 288 °C) and chemical attack, CAF-resistant, Low z-Axis-Expansion, Compatible with the new lead free processes. |
|
PCL
370HR |
≈ 180°C |
High-Tg FR-4 laminate and prepreg with a Tg of 170 - 180 °C (DSC). Offers very high resistance to heat (8 pass at 288 °C) and chemical attack, CAF-resistant, Low z-Axis-Expansion, Compatible with the new lead free processes. |
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| Halogene-Free |
| DE156 |
≈ 150 °C |
Halogene-Free FR-4 with good thermal stability. Meeting new environmental regulations as well as the new lead-free processes. |
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| IS500 |
≈ 170 °C |
Halogene-Free High-Tg FR-4 with a very high resistance to heat, meeting new environmental regulations as well as the new lead-free processes. |
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| Low DK and Df |
| FR408 |
≈ 180 °C |
High-Tg laminates and prepregs with low dielectric constant and low dissipation factor for microwave applications. |
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| Conventional products |
| DE104 |
> 130 °C |
Rigid, thin FR-4 laminate and prepreg. Glass-epoxy type. Offer a high dimensional stability and good thermal stability. For manufacturing of Rigid and multilayer boards. |
|
| DE104KF |
> 130 °C |
Rigid FR-4 laminate with a high tracking resistance (CTI 400). Particularly adapted to baords used in corrosive environment. |
|
| DE114 |
≈ 150 °C |
Thin FR-4 multilayer laminates and prepregs. Glass-epoxy-type. With a Tg of approximately 150 °C |
|
| DE117 |
≈ 170 °C |
Thin FR-4 multilayer laminates and prepregs. Glass-epoxy-type. With a Tg of approximately 170 °C. Qualifies to Multilayer with high layer count |
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