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Polyimide
For High-Temperature-Applications Multilayer, Prepreg, No-Flow and Resin-Filler
Resin
Product Description
Tg
Type/IPC-4101
UL-94
Fabric
Comments
PDF
33N
Kerimid 701 (V0) Non-MDA Polyimide
250°C
GIL /40; 41
V0
E
Maximum Flame Retardance
35N
Kerimid 701 (V1) Non-MDA Polyimide
250°C
GIL /40; 41
V1
E
Drilling Enhanced
85N
Non-MDA Polyimide - Unmodified
250°C
GIL /40; 41
HB
E
Maximum Thermal Stability
84N
Multifilm Hole-Fill Prepreg
250°C
GIL /40; 41
N/A
E
Filled 85N
37N
No-Flow Polyimide Prepreg
200°C
GIJ /42
N/A
E
Non-MDA, Rigid Flex
38N
Low Flow Polyimide Prepreg
210ºC
GU/42
N/A
E
Non-MDA Flex Rigid
HF-50
Hole-Fill Compound
250°C
N/A
N/A
None
Fill Clearance Holes
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