CCI Eurolam - Partner of the European PCB Industry

Polyimide

For high-temperature applications, multilayer, prepreg, no-flow and resin filler

Resin	Product Description	Tg	Type/IPC-4101	UL-94	Fabric	Comments	PDF
EP2	Enhanced Polyimide	250°C	GIL /40; 41	V0	E	Filled, high peel strength, thermal reliability
33N	Kerimid 701 (V0) Non-MDA Polyimide	250°C	GIL /40; 41	V0	E	Maximum Flame Retardance
35N	Kerimid 701 (V1) Non-MDA Polyimide	250°C	GIL /40; 41	V1	E	Drilling Enhanced
85N	Non-MDA Polyimide - Unmodified	250°C	GIL /40; 41	HB	E	Maximum Thermal Stability
84N	Multifilm Hole-Fill Prepreg	250°C	GIL /40; 41	N/A	E	Filled 85N
37N	Low-Flow Polyimide Prepreg	200°C	GIJ /42	N/A	E	Non-MDA, rigid-flex
38N	Low Flow Polyimide Prepreg	210ºC	GU/42	N/A	E	Non-MDA, rigid-flex
HF-50	Hole-Fill Compound	250°C	N/A	N/A	None	Fill Clearance Holes