CCI Eurolam


Thermal Management Print E-mail
Products for Thermal Management as heat-distributing basematerial based with an Aluminium carrier. 
IMS: Aluminium/dielectric/copper laminates:
SMI is a solution to heat dissipation problems, allowing simple PCB designs. IMS is an alternative to solution such as heat sinks or ceramic substrates, often linked with interconnection difficulties.
SMI can be used in such fields as high voltage applications, power PCBs, coolers for transistors, thyristors, regulators, SMDs, power-LEDs, and in the automotive industry.
We propose a range of IMS products: IMS-11 , IMS-20 and IMS-25  in order to fit all types of applications:
  • Thermal conductivity: 1 or 2,7W/K.m
  • ED-Copper: 18, 35, 70, 105, 210 µm
  • Aluminium-Thickness: 0,8 - 1,0 - 1,5 - 2,0 - 3,0 mm
  • Standard size: 500x600mm
 


Special prepreg with high Thermal conductivity:
Resin
Product Description
Tg
Type/IPC-4101
UL-94
Fabric
Comments
PDF
91ML
Thermally Conductive – lead free and halogen free
170°C
GFG/98
V0
E
1.0 W/m-K
Download PDF-Datasheet
92ML
Thermally Conductive - lead free and halogen free
170°C
GFG/98
V0
E
2.0 W/m-K Multilayerable System
Download PDF-Datasheet
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