| Products for Thermal Management as heat-distributing basematerial based on CML-6 or FR-4 prepreg with an Aluminium carrier. | |
| General: SMI is a solution to heat dissipation problems, allowing simple PCB designs. IMS is an alternative to solution such as heat sinks or ceramic substrates, often linked with interconnection difficulties. SMI can be used in such fields as high voltage applications, power PCBs, coolers for transistors, thyristors, regulators, SMDs, power-LEDs, and in the automotive industry.
| | SMI FR-4
| Datasheet | Standard-Constructions ED-Copper: 18, 35, 70, 105, 210 µm Aluminium-Thickness: 0,8 - 1,0 - 1,5 - 2,0 - 3,0 mm other constructions on request
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