Copper foils for Multilayer, High-Temperature, Flex and various other applications
Foil products are marketed under the trademark “JTC.” The letter “J” denotes the coating that prevents oxidation during processing and the letters “TC” represent the brass coating recognized worldwide for promoting reliability in thermal applications. Gould is the only producer of freestanding foil in thicknesses ranging from9 µm (0.25 oz) to 400 µm (10 oz).
JTC or Grade 1
Thiscopper is a multipurpose foil commonly used for rigid, composite and mass lamination applications. Foil thicknesses, which range from 9 µm (0.25 oz) to 400 µm
JTCS or Grade 3 HTE Copper Foils for Multilayer
Resistance to Recrystallization – Low profile JTCS is formulated to resist recrystallization or grain growth after thermal processing. Recrystallization contributes to dimensional change, warp and twist, and nailheading.
Resistance to Innerlayer Cracking – JTCS foils are formulated with a balance of tensile strength for handleability and ductility for resistance to innerlayer foil cracks. Tensile strengths equivalent to Grade 1 foils permit JTCS foils to process with handleability and dent resistance of standard Grade 1 foils.
Properties – JTCS foil is routinely available in continuous rolls in thicknesses from 9 µm (0.375) to 210 µm. The 12 µm (0.375 oz) JTCS Foil has a minimum of 2% elongation at 180° C. This is the copper we usually have in stock
JTCSHP - JTCSAB
Higher profile and higher nodularization increase mechanical adhesion. Specialty silanes on foil increase chemical bonding to high performance resin systems. Tailored to enhance adhesion to specialty resins.
JTCSHP: Hi-Performance JTCS (Grade 3) foils are specially treated to bond to high
performance, high Tg resin systems.
JTCSAB: Grade 3 Advanced Bond foils are treated with a special silane that bounds with non-MDA polyimide resin, thereby increasing peel strength.
