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CIC
Copper-invar-copper foils are used for tight tolerance MLB registration, core ground and power planes, low TCE and heat sinking applications.
Advantages:
Superior dimensional stability.
Inherent ground and power plane.
TCE match with ceramic chip carriers.
Superior bonds with when treated
Standard CIC has a thickness of 6 mils with a ratio of 12.5%/75%/12.5%
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