PACOTHANE is a Release Film that provides quick and easy release between multilayer and protects copper from pits and dents caused by defective plates and air-born contaminants. With a low shrinkage, PACOTHANE will avoid wrinkles. PACOTHANE 1500: thickness 38µ, operating temperature up to 204°C for up to 6 hours. Smooth and antistatic versions available.

PACOLON is a line of ultra high performance Release Films. PACOLON films are engineered to provide excellent, contamination-free release during the process of laminating Rigid Polyimide PCBs, all Flexible Circuit Boards, Teflon and other demanding applications. PACOLON 2000: thickness 50µ, operating temperatures in excess of 260°C.

PACO•VIA is engineered to provide an easy and reliable technique for laminating multilayer Printed Circuit Boards which incorporate buried and blind via hole techno-logy. PACO•VIA prevents blind via resin overflow and provides discreet control of liquid resin so that internal buried via hole barrels will be completely filled.
PACO•VIA 3000: thickness 75µ, operating temperature of 218°C up to 4 hours.