PACOPLUS is a Conformable Release literature that brings reliability and consistency to the process of conforming Coverlays and producing Rigid Flex. Used in conjunction with PACOPADS, the "PACOPLUS SYSTEM" replaces all other pad make-up materials now used in the Flex lamination process. It will help to solve issues like Entrapped Air, Internal Mis-Registration (Flex Multilayer), and adhesive bleed into open areas. PACOPLUS 4000: thickness 300 µ, operating temperature: 204°C

PACOCORE is an application-engineered, Conformable Hydraulic Film. Like PACOPLUS it provides optimized flow and conforming properties that are repeatable and predictable. PACOCORE is suitable for manufacture of Flex, Rigid-Flex, and Ball Grid Array, PCB designs and has to be used with release foil like PACOTHANE or PACOLON. Thickness: 50 to 250 µ, operating temperature: 204°C.

PACOFLEX – Conformable Release Film

PACOFLEX is an adhesive & resin blocking, Conformable Release Film. It is specifically engineered for the Lamination of Cover-Layers to Flexible Printed Circuit Boards. PACOFLEX contains no silicone or other additives that transfer to the Cover-Layer surface. PACOFLEX 5000: thickness 125 µ, operating temperature: 204°C.