| DuPont Printed Circuit Materials is fully focused on meeting its customers imaging needs, with unsurpassed service and high performing Riston® photopolymer dry film resists that deliver fine lines at high yields in every major Printed Wiring Board application.
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RISTON® DRY FILM
Reference | Description | Name | Thickness | Riston® series T200 | Robust film for all applications, includingAcid and Alkaline Etching, Plating | T215 | 38µ | T220 | 50µ | Riston® series | High productive resist for rapid Exposure, Development and Stripping; Acid Etching
Fine line innerlayer performance | Acid etch | ES102 | 30µ | Acid etch and Cu, Sn plate | ES140
ES150 | 38µ
50µ | Acid and Alkaline etch | EM830 | 30µ | Riston® series | Excellent Tenting and plating resist with increased flexibility and productivity | Acid Etching, Plating | PM240 | 38µ | PM250 | 50µ | Plating (Cu/Sn/SnPb) | PM275 | 75µ | Riston® series MM100 et 500 Multi Master | General purpose resist, strong performance in high PH alkaline etch and aggressive gold plating
| MM 500 Robust resist | MM530 | 30µ | MM540 | 38µ | MM550 | 50µ | MM100 High Productivity resist | MM140 | 38µ | MM150 | 50µ | Riston® series Laser Direct imaging
| Very high photo speed resists for direct laser imaging. Acid and Alkaline Etching, Plating | LDI530 | 30µ | LDI540 | 38µ | LDI550 | 50µ | Riston® series Special FX 900 | High tech/Fine line resist Excellent flow during lamination | Acid and alkaline etch | FX920 | 20µ | Acid and alkaline etch | FX930 | 30µ | Acid and alkaline etch, Plating Cu, SnPb | FX940 | 40µ | Acid and alkaline etch, plating Cu, SnPb | FX950 | 50µ | Riston ® series FX250
Special series | Specialty product for slective e-less Ni/Au ENIG (electroless nickel immersion Gold) | The resist for selective e-less Ni/Au | FX250 | 50µ |
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