At each step of your process, Oxford Instruments brings solutions to control and increase security of your processes and products.
CM95: Identifying copper thickness
Micro resistance method: Unlike other test methods, it is not affected by copper coating on the opposing side of the printed circuit board. Only available handheld gauge that measures the entire range of copper foil thicknesses from 5 to 140 µmExclusive soft touch probe to prevent the copper surface from being marred or scratchedProven durability and simple to useFactory calibrated and requires no standard Datasheet
CMI165: Measuring copper thickness
Micro resistance method: allows accurate measurement without being affected by copper coating on the opposing side of the PC Enable to measure copper thickness on plain surface and even on PCB tracks. Datasheet
CMI511: Measuring plated thru-hole copper
prior to and after etching
Portable gauge capable of measuring plated thru-hole copper prior to and after etch.
Automatic temperature compensation allows for accurate measurement of plated thru-hole copper immediately after pulling from the tank
Works equally well on double-sided and multi-layer boards, even through tin and tin/lead resist
High and low limits can be set and up to 2000 readings can be stored in memory
