• FR1 - CEM1 - CEM3

• FR4 copper clad epoxy laminates - Rigid, multilayer and prepregs

• High Tg laminates and prepregs

• Polyimide glass prepregs and laminates

• No-flow epoxy and polyimide prepregs TG from 130 to 200¡C

• Special prepregs (heat conductive) - Filling prepregs - Powder

• Thermount¨ Epoxy - Polyimide - Laminates and prepregs

• Large range of microwave laminates - High frequency bonding films and prepregs

- Microwave foam

• Substrates on aluminium carrier (SMI)

• Dry Film Photoresist

• Diazo Artwork film

• Dry Film Soldermask

• Silver film

• Copper foil - High performance copper foil (9 to 210 µm)

• CSC: Copper/Steel/Copper - CAC: Copper/Alu/Copper

• CIC: Copper/Invar/Copper - Treated and not treated copper

• TCR (Embedded resistor)

• Flexible polyimide copper clad laminates with and without adhesives

• Polyimide coverlay and cast adhesives

• Polyester laminates and coverlay

• Release films - Special release films for blind vias and SBU

• Press pad materials

• High performance multilayer pressing tools and separators

• Pressure sensitive measurement kit

• Wood - Melamined wood
• Aluminium entry drilling boards

• High performance drilling entry and backup material

• Tooling plates

• Tungsten carbide drills - Strong and medium webs

• Tungsten carbide routers - Diamond cuts, chip breaker and end-mill tools

• Special carbide tools made on request

• High performance punching tools and systems

• Contamination control products

• PCB tapes

• Rubber rolls for laminators

• Drill room supplies

• Imaging material, Artwork Protection Film