COVID-19. Our group has taken safety measures such as strict rules for hygiene, social distancing, cancelling travels and home office to all function whenever possible. Learn more

Electrolytic copper plating

Request a sample

DuPont’s longstanding expertise in copper plating is an excellent match for the demands of high density pcb including rigid-flex . DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

Have a question? Get in touch

Copper plating & via filling

Current Designation Features

Pulse

COPPER GLEAM PPR

High productivity

Pulse

COPPER GLEAM CUPULSE

High aspect ratio (~15)

Direct

COPPER GLEAM PC

Simplicity of analysis and control (mono additive)

Direct

COPPER GLEAM CLX

Excellent properties with large process window

Direct

ELECTROPOSIT 1300

Designed for compatibility with direct plate. Easy control with Hull cell.

Direct

COPPER GLEAM HT55

Excellent distribution and elongation

Direct

COPPER GLEAM HGX

Very high ductility, flex circuits, soft materials

Direct

MICROFILL EVF

Small holes and blind vias

Direct

MICROFILL THF

designed to provide through hole fill

Additional products and information

Have a question?

If you need any assistance or have queries regarding our company or products, please do not hesitate to contact us.
  • Dieses Feld dient zur Validierung und sollte nicht verändert werden.