PCB
Metallisierung
Oberflächenbehandlung
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Gedruckte Elektronik
Assembly
Mikroelektronik
Leistungselektronik
Adhesives
Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...
Gedruckte Elektronik
Agfa’s PEDOT:PSS-based materials
Agfa’s PEDOT:PSS-based pastes, inks, coating and formulations for screen and inkjet printing are appreciated in a variety of industry segments
Leistungselektronik
ALN paste system
Functional ceramic materials for Aluminium Nitrade substrate
Leistungselektronik
Alu, Glass & Steel paste systems
Aluminium, Glass, Steel special thick film paste system
PCB
Basismaterial
Arlon Hi-Rel PI & no-flow
Arlon EMD ist ein führender Hersteller von speziellen Hochleistungslaminaten und Prepregs für den Einsatz in anspruchsvollen und vielfältigen Märkten für Leiterplatten.
PCB
Bohren
Backup boards
Wir bieten die größte Auswahl an Backup-Materialien für Leiterplattenbohrungen für alle Anwendungen und Anforderungen.
Leistungselektronik
Bonding wires
Silver, Copper & Gold bonding wires
PCB
Equipment
BÜRKLE Lamination Presses
The relevance of PCB production is also growing with the advancing digitalisation as the use of PCB extends to all areas of life.
Holz & Glas
BÜRKLE Surface Finishing Systems
With modern and innovative technologies, BÜRKLE provides you with high quality solutions for the finishing (laminating, lacquering, printing...) of the surfaces of wood-based panels.
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