PCB
Metallization
Surface Treatment
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Printed Electronics
Assembly
Microelectronics
Ceramic Circuit
Adhesives
Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...
PCB
Imaging
Chemical Milling
AGFA DiPaMat® Jettable Inks
AGFA Jettable legend inks, etch resist & soldermask enable patterning process generated by jetting uniform droplets on a substrate.
Printed Electronics
Agfa’s PEDOT:PSS-based materials
Ceramic Circuit
ALN paste system
Functional ceramic materials for Aluminium Nitrade substrate
Ceramic Circuit
Alu, Glass & Steel paste systems
Aluminium, Glass, Steel special thick film paste system
PCB
Basematerial
Arlon Hi-Rel PI & no-flow
Arlon EMD is a leading manufacturer of specialty high performance laminate and prepreg materials for use in printed circuit board applications across demanding and diverse markets.
PCB
Drilling
Backup boards
We offer the largest range of PCB drilling backup materials for all applications and requirements.
Ceramic Circuit
Bonding wires
Silver, Copper & Gold bonding wires
PCB
Equipment
BURKLE Lamination Presses
The relevance of PCB production is also growing with the advancing digitalisation as the use of PCB extends to all areas of life. Almost every electronic device today contains one or more printed circuit boards. For more than 45 years already, BÜRKLE has been serving PCB manufacturers worldwide as a line manufacturer with advanced laminating technologies and is always one step ahead of the times.
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