Circuit imprimé
Métallisation
Traitement de surface
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Electronique imprimée
Circuit céramique
Adhesives
Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...
Circuit imprimé
Image
Gravure chimique
AGFA DiPaMat® Jettable Inks
AGFA Jettable legend inks, etch resist & soldermask enable patterning process generated by jetting uniform droplets on a substrate.
Electronique imprimée
Agfa’s PEDOT:PSS-based materials
Circuit céramique
ALN paste system
Functional ceramic materials for Aluminium Nitrade substrate
Circuit céramique
Alu, Glass & Steel paste systems
Aluminium, Glass, Steel special thick film paste system
Circuit imprimé
Substrats
Arlon Hi-Rel PI et sans fluage
Arlon EMD est l'un des principaux fabricants de stratifiés et préimprégnés haute performance, destinés à être utilisés dans des applications liées aux circuits imprimés sur des marchés exigeants et diversifiés.
Circuit imprimé
Perçage
Backup boards
We offer the largest range of PCB drilling backup materials for all applications and requirements.
Circuit céramique
Bonding wires
Silver, Copper & Gold bonding wires
Circuit imprimé
Cuivre
CAC (Cu/Alu/Cu) & CSC
CAC® (Copper Aluminum Copper) and CSC patented product featuring copper foil attached in their 'state-of-the-art' clean room to one or both sides of an aluminum separator sheet based on the PCB application.
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