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Métallisation
Traitement de surface
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
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Conductors
Micromax™ has a broad offering of conductors including Platinum, Silver and gold-based alloys (Pd and Pt) conductors
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Image
Métallisation
Developer, Stripper & ancillaries
Qnity DuPont Electronic Solutions compliments its range of photo imageable products with a wide range of supporting products for developing, etching and stripping processes.
Micro-électronique
DuPont Photoresists
DuPont offers a robust, production-proven photoresist product line for semiconductor manufacturing processes, from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm, from our i-line/g-line, to our 193 and KrF product families, combined with DuPont’s etching, developing and ancillary products.
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Nettoyage
DuPont™ Sontara® Wipes
Unlike many nonwoven fabrics, Sontara® uses no binders, chemicals or adhesives. It has exceptional mechanical strength, excellent absorbency, and because the fibers are washed during fabric formation, it exhibits very low lint.
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Métallisation
Electrolytic copper plating
DuPont electrolytic copper plating and via filling advanced chemistry
Traitement de surface
Gold & Gold-alloys deposition
Pure Gold and various alloys: Au/Co, Au/Cu (2N, 3N, 5N), Au/Cu/Cd, Au/Ni, Au/Ag for decorative and Technical applications (Wire bonding)
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Métallisation
Inner layer bonding
Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
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Gravure chimique
Liquid photoresist
DuPont Photoposit™ range of negative and positive liquid photoresists enable uniform thin coatings for improved surface conformance, fine-line etching performance, as well as lower costs and reduced waste.
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Métallisation
Making hole conductive
DuPont longstanding expertise in electroless copper plating solutions
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