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Comprehensive range of silver, carbon and dielectric pastes
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| Application |
Composition
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Product Code
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Features
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Printed Electronics |
• Carbon | 7105/7102 |
Low cost carbon < 30/<20 Ω/sq/mil |
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Printed Electronics |
• Silver | 5025 | All round performance: 12 to 15 mΩ/sq/mil | |
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Printed Electronics, RFID |
• Silver | 5028 | High conductivity: < 12 mΩ/sq/mil |
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Printed Electronics, RFID |
• Silver | 5065 | Very high conductivity: 5 - 10 mΩ/sq/mil |
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Printed Electronics, RFID |
• Silver | 5029 | High conductivity, thick print up to 30 µm Laminated: 4 to 8 mΩ/sq/mil |
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Printed Electronics |
• Ag composite | PE825 / PE826 | Low AG content 37% / 18% |
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RFID/HF (NFC) |
• Ag Alloy | PE815 | Low silver 27% Ag, photonic cure and calendar | |
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Printed Electronics |
• Dielectric | 5018/5018A/G | Insulation resistance > 10 GΩ/sq/mil, UV curing, Dk 4,4 - breakdowm voltage > 500 V/mil DC |
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