Release products

 

 
Material
Technical specifications Advantages PDF
Pacothane 1500
thickness 38 µm, operating temperature up to 204 °C for up to 2 hours High Performance Release Film provides quick and easy release between multilayers and protects copper from pits and dents caused by defective plates and air-born contaminants; low shrinkage
Download PDF-Datasheet
Pacolon 2000
thickness 50 µm, operating temperatures in excess of 260 °C
High Temperature Release Film   
provides excellent, contamination-free release during the
process of laminating rigid Polyimide PCBs, all flexible circuit boards, Teflon and other demanding applications
Download PDF-Datasheet
Thermofilm
 
thickness 38 µm, operating temperature of 340 °C up to 2 hours Ultra-High Temperature Easy Release Film
offers the consistent attainment of proper release, surface protection and conformability under the harsh conditions and challenges of elevated temperature laminations. Extremely low X&Y Axis shrinkage.
Download PDF-Datasheet
Paco-Via
 
thickness 75 µm, operating temperature of 218 °C up to 4 hours Blind Via Hole Lamination System
prevents blind via resin overflow and provides discreet control of liquid resin so that internal buried via hole barrels will be completely filled
Download PDF-Datasheet
Paco Clutch
 
thickness 280 µm, operating temperature of 218 °C up to 2 hours
 
Used with Cap layer structures
Decouples etched cores from the separator plate
Improves dimensional stability
Download PDF-Datasheet

 

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