PACOTHANE TECHNOLOGIES-PACOLON™-FOR LAMINATION OF MULTILAYER AND FLEXIBLE CIRCUITS
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PACOTHANE TECHNOLOGIES-PACOFLEX™ 10000- For lamination of coverlays and flexible circuits
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PACOTHANE TECHNOLOGIES-PACO•VIA™ 3200- BLIND VIA HOLE LAMINATING FILM
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PACOTHANE TECHNOLOGIES-PACO•CLUTCH™-SINGLE COMPONENT, CONFORMABLE « CLUTCH » FILM PACKAGE FOR PCB « CAP » LAMINATIONS
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Circuit imprimé,
Pressage
PACOTHANE TECHNOLOGIES- Paco-Clutch™ A SINGLE COMPONENT, CONFORMABLE « CLUTCH » FILM PACKAGE FOR PCB « CAP » LAMINATIONS
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Pacoflex Ultra
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Substrats
NIKKAN INDUSTRIES CO-NIKAFLEX® SAFV
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Substrats
NIKKAN INDUSTRIES CO-NIKAFLEX® SAFG
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Substrats
NIKKAN INDUSTRIES CO-NIKAFLEX® F30VC
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Substrats
NIKKAN INDUSTRIES CO-NIKAFLEX® CISV
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Circuit imprimé,
Substrats
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