Partenaires

Hi-Performance copper clad laminates and prepregs

Flexible polyimide laminates, coverlays & adhesives

High Reliability PI & no-flow

Microwave and thermally conductive laminates and prepregs

FR2, CEM-1, FR4 and copper

PCB & GMF surface treatment chemistry and photoresist

Silver film, jettable ink and chemistry

Lamination enhancement products and technologies

Copper Aluminium Copper Copper Steel Copper

Printed electronics inks and thick film pastes

Copper foils

Copper foils

Solid tungsten carbide drills and routers

High performance entry and backup material

Transparent conductors

Functional ceramic materials for Aluminium Nitride substrate

Resistive foils

Pressing tools, register pins and release agents

Contamination control adhesive materials

Piezoelectric electroactive polymers

Dry electrodes and adhesives

Coating measurement equipment

Technical cleaning

Special paper substrate for printing electronics