Pyralux® Flexible Material

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Qnity extensive family of Pyralux® and Nikaflex® products expands possibilities for flexible laminates in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux portfolios includes a diverse collection of core dielectric materials and customized constructions that enable low loss for high-speed, high-frequency applications, high service temperature for automotive and aerospace applications.

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All Polyimide and Acrylic based adhesive solutions

Reference	Description	Adhesive type	UL-94	MOT °C
PYRALUX® AC	All-polyimide single sided cast-on-copper adhesiveless copper-clad composite made of polyimide and copper foil.	Adhesiveless	V-0	155
PYRALUX® AG	All-polyimide double sided copper-clad autoclaved laminates.	Adhesiveless	V-0	130
PYRALUX® AP	All-polyimide double-sided copper-clad autoclaved laminates.	Adhesiveless	V-0	200
PYRALUX® APR	Laminate adhesiveless, all-polyimide in combination with TCR® Thin-Film Embedded Resistor Copper Foil from Ticer Technologies.	Adhesiveless
PYRALUX® HT	Thermoplastic polyimide bonding film for coverlay or bond ply in flex/rigid-flex circuits. Offers low loss, high temperature resistance, signal integrity, and reliability.	All PI	V-0	200
PYRALUX® LF	Complete Product line of copper-clad laminates, coverlays coated on one or both sides and cast adhesive films constructed with a proprietary modified acrylic adhesive and of DuPont Kapton® polyimide film.	modified acrylic		200
PYRALUX® ML	DuPont’s Kapton® polyimide laminates cladded with one or two sides Constantan alloy foil, CuNi44.
PYRALUX® FR	Complete Product line of copper-clad laminates, coverlays coated on one or both sides and cast adhesive films constructed with a proprietary flame retardant ULVTM0 acrylic adhesive and of DuPont Kapton polyimide film.	proprietary flame retardant ULVTM0 acrylic	V-0	105

Fluoropolymer adhesive solutions

Pyralux® TK is a PTFE/polyimide composite double sided CCL and bondply ideal enabling remarkable signal integrity in high speed digital and high frequency flex and rigid-flex applications where Dk must fall below 3.0.

Reference	Description	Adhesive type	UL-94	MOT °C	CCL	Coverlay	Bondply	Adhesive
PYRALUX® TK	Flexible Kapton Material with Teflon® to produce high frequent Flex-PCBs. Dk 2.3 or 2.5, dissipation factor 0.0015 – 0.002 at 10 GHz.	PTFE based	V-0	200

Epoxy based adhesive solutions

Reference	Description	Adhesive type	UL-94	MOT °C
PYRALUX® HP	Epoxy based unsupported adhesive formulated for high-speed high-frequency flexible circuit applications, with low values on Dk and Df.
NIKAFLEX® F30VC	DuPont Kapton® polyimide Copper-clad laminates.	flame retardant epoxy	V-0	130
NIKAFLEX® CISV	Single sided coverlay constructed with DuPont Kapton® polyimide film.	flame retardant epoxy	V-0	130
NIKAFLEX® SAFV	Epoxy based cast adhesive.	flame retardant epoxy	V-0	130
NIKAFLEX® SAFG	Epoxy based cast adhesive.	flame retardant epoxy	V-0	130

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Pyralux® Flexible Material

All Polyimide and Acrylic based adhesive solutions

Fluoropolymer adhesive solutions

Epoxy based adhesive solutions

All Polyimide and Acrylic based adhesive solutions

Fluoropolymer adhesive solutions

Epoxy based adhesive solutions

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