Assemblage - Page 2 sur 2 - Products - CCI Eurolam

Demander un échantillon

Circuit imprimé Electronique imprimée Circuit céramique Traitement de surface Gravure chimique Photovoltaïque

Solder Paste

As a leader in soldering technology, Indium Corporation offers a number of solder pastes for assembly with many different alloy choices and flux technologies to solve many of your process challenges such as miniaturized components, fine-pitch, voiding, printing and reflow performance.

Solder Preforms

Indium Corporation is a world-leader in the design and manufacture of high-quality solder preforms, used in a variety of applications that require precise amounts of solder or flux, such as pin-in-paste, void reduction or uniform bondline . They are and available in various shapes, sizes and alloy, with the possibilty to have flux coating or reinforcement.

ELPEGUARD® Conformal Coating

ELPEGUARD® conformal coatings are used to protect and insulate assembled pcbs so that they can fulfil higher requirements regarding reliability and service life.

ELPECAST® Casting Compounds

ELPECAST® casting compounds protect and insulate electronics, sensor technology and lighting electronics against extreme weather conditions and aggressive media. A large variety of transparent and opaque products fulfills numerous individual requirements and customer requests.

Solder Wires & Fluxes

Indium Corporation manufactures a broad range of solid and flux-cored solder wire. Available in several diameters, several alloys and high to very low flux %. It manufactures as well a broad range of TacFlux™ and flux pens.

Thermabond® Adhesives Film

Thermabond® Silicone Electronic Adhesive products by Rogers Corporation are thermally conductive silicone rubber-based adhesives for decoupling CTE and heat induced stress in electronic assemblies

Metal TIMs

The dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Indium Corporation is a leader in the development of both solder and metal-based thermal interface materials (TIM) for a wide variety of applications.

Semiconductor Assembly

Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future with solders and flux for System-in-Package (SiP), Heterogeneous Integration Assembly (HIA), MEMs assembly, flip chip bonding and BGA ball attach.

Adhesives

Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...

Electrically conductive adhesives

Electrically conductive adhesives are employed in integrated circuit packaging in order to provide a permanent mechanical connection for joining components and at the same time enabling electrical contact of the components.