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Métallisation
Demander un échantillon
Circuit imprimé
Electronique imprimée
Circuit céramique
Traitement de surface
Gravure chimique
Photovoltaïque
Making hole conductive
Electrolytic copper plating
Inner layer bonding
PCB final finishes
3D-MID
Developer, Stripper & ancillaries
Encres pour circuits imprimés
Making hole conductive
DuPont longstanding expertise in electroless copper plating solutions
Electrolytic copper plating
DuPont electrolytic copper plating and via filling advanced chemistry
Inner layer bonding
Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
PCB final finishes
ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Developer, Stripper & ancillaries
DuPont Electronic Solutions compliments its range of photo imageable products with a wide range of supporting products for developing, etching and stripping processes.
Encres pour circuits imprimés
Argent imprimable et encres cuivre pour les applications de traçage et de remplissage de circuits imprimés