WBR Series Dry Film Photoresists for Wafer Bumping
Demander un échantillonWBR Dry Film Photoresists for Wafer Bumping deliver excellent performance in both photo stencil and electroplating processes, and are available in a range of 50-120 microns thicknesses.
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Advanced Packaging Product Benefits:
Higher yield and quality through uniform resist thickness across the entire wafer
Higher productivity without need for drying or double coating; no edge bead removal
Low waste generation with up to 73% yield polymer use
Environmental benefits from reduced material wastage and a solvent free process
WBR2000 Series
WBR 2000 dry film photoresists are high resolution, multi-purpose films compatible with lead-free electroplating and stencil printing applications. These films are available in 50, 75, 100 and 120 micron thicknesses.
Product Features:
Negative working, aqueous, processable polymer film
High aspect ratio resolution
Suitable for in-via and mushroom electroplating bumping applications
Suitable for copper pillar and other lead free applications
High heat resistance for stencil printing bumping applications