Solder Paste
Demander un échantillonAs a leader in soldering technology, Indium Corporation offers a number of solder pastes for assembly with many different alloy choices and flux technologies to solve many of your process challenges such as miniaturized components, fine-pitch, voiding, printing and reflow performance.
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Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing industry. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.
No Clean Lead Free Solder Pastes
Indium offers a large range of lead-free solder pastes with a variety of SAC alloys. From the industry standard SAC305 to lower silver contents SAC such as SAC0307, SAC105, SACm (doped), as well as new alloys such as Indalloy®292 engineered to provide advanced reliability for high-performance applications.
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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Indium8.9HFT |
SAC |
Next generation best all-around halogen-free paste. One year shelf life. 60 hours stencil life. |
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Indium8.9HFRV |
SAC |
High TCT performance, low voiding, No-Clean paste. |
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Indium10.8HF |
SAC |
Addresses non-wet opens (NWOs) |
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Indium12.8HF |
SAC |
Specifically for fine-feature printing |
Low Silver Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
|
Indium8.9HFT |
SAC0307 |
Most standard low silver alloy |
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Indium8.9HFT |
SAC105 |
1% silver |
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Indium8.9HFT |
IND291 |
Sn100C alloy |
Jetting and Microdispensing Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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PicoShot® NC-5M |
SAC305 |
No Clean. Optimized for Mycronic MY600 and 700 systems. Type5. Smallest dot 7.5nl/dot, 360μm. |
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PicoShot® NC-6M |
SAC305 |
No Clean. Optimized for Mycronic MY600 and 700 systems. Type6. Smallest dot 1.6nl/dot, 230μm diameter. |
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PicoShot® WS-5M |
Sn63Pb37 |
Water soluble. Optimized for Mycronic MY600 and 700 systems. Type5. Smallest dot 7.5nl/dot, 360μm diameter. |
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PicoShot® NC-5M |
Sn63Pb37 |
No Clean. Jettable. Type5. Smallest dot 7.5nl/dot, 360μm diameter. |
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Indium 12.8HF |
Pb or Pb-Free |
Compatible with 8.9HF, exceptional microdispense and jetting features. Available in Type 5, 5MC, 6, 6SG, 6SGS, 7, 7SG. |
No Clean Sn Pb Solder Pastes
| Name | Alloy | Description | Datasheet |
|---|---|---|---|
|
NC-SMQ92J |
SnPb |
Industry-leading solder paste with a soft residue that reduces false failures at ICT. |
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NC-SMQ92H |
SnPb |
Modified version of NC-SMQ92J that maximizes print performance. |
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NC-SMQ51SC |
SnPb |
Exceptional stencil life and tack strength, and consistent print definition in ultra-fine pitch applications. |
Water Soluble Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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Indium3.2HF |
SAC Alloys |
Halogen-free lead free solder paste |
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Indium6.6HF |
SnPb alloys |
Low voiding solder paste with a wide reflow window |
Low Temperature Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
|
Indium10.8HF |
DurafuseTM LT |
Patented alloy. Greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market. |
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Indium5.7LT-1 |
BiSnAg alloys |
Low-temperature, Pb-free solder paste designed for assembly processes using Bi-based low-temperature alloys. |
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NC-SMQ80 |
InSn alloys |
InSn solder paste specially designed for low temperature applications that need high mechanical reliability. |
High Temperature and High Rel Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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Indium8.9HFT |
SnSb alloys |
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NC-SMQ80 |
InPb alloys |
Specialty solder paste for soldering to gold surfaces |
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NC-SMQ51SC |
AuSn alloys |
For high-power LEDs and MEMs, and die-attach applications. |
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IND292, IND276, |
High Reliability |
RMA Solder Pastes
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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RMA-155 |
SnPb and Pb free alloys |
RMA solder paste with excellent soldering performance for military applications |
FAST Formic Acid Soldering Technology
| Product Name | Alloy | Description | Datasheet |
|---|---|---|---|
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FAST Paste |
Pb-free and High-Pb |
Flux-less paste specially developed for formic acid reflow. |
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FAST Inform® and Preforms |
Pb-free and High-Pb |
High-quality preform solder and Inform ideal for fluxfree reflow soldering with formic acid. |
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FAST InTack® |
na |
Flux-free tacking agent |
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