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Métallisation
Electrolytic copper plating
DuPont electrolytic copper plating and via filling advanced chemistry
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Métallisation
Making hole conductive
DuPont longstanding expertise in electroless copper plating solutions
Traitement de surface
Metal deposition & finishing
Gold, Copper, Silver, Nickel, Chrome, Bronze, Ruthenium, Palladium, Tin and various alloys plating processes and finishing.
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Métallisation
Equipement
Traitement de surface
PAL Vertical Plating Lines
PAL designs and supplies custom-built plating equipment for PCB, semiconductor and general metal finishing applications throughout the world.
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Métallisation
PCB final finishes
ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.
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Peters ELPEPCB Coatings
Peters, a global leader in the field of electronics-related high-tech coatings, offers the complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing from solder masks to marking inks.
Traitement de surface
Plating on Plastic
High-performing, Environmentally-friendly Metal Plating on Plastic Surfaces processes.
Equipement
Traitement de surface
Precious metal recovery
Recovery of precious metals in your metallization baths as well as in your static rinses by electrolysis.
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Gravure chimique
Riston® Dry films
DuPont™ Riston® dry film photoresists for high yield, productivity, ease of use, finer features, higher quality and lower cost in all types of plating and etching applications as well as LDI exposure.
Micro-électronique
Semiconductor Packaging Materials
DuPont develops new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out WLP and TSVs. DuPont is a technology leader in electroplating materials used for UBM, RDL, Cu pillars, and solder bumps, along with polymers and dielectrics for RDL, photoresists and TSV fill.
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