DuPont Low Temperature Co-Fired Ceramic (LTCC) Material Systems for extreme heat and other harsh environments which can push electronic solutions to their limits. Advanced ceramic materials are designed to withstand the toughest conditions and enable smaller, more reliable electronics.

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Green Tape™ 951 - All around performance

The DuPont™ GreenTape™ 951 low temperature co-fired ceramic (LTCC) material system combines the benefits of multilayer co-fired ceramic and thick film technologies to meet the increasing demand for reliable electronics functioning in extreme heat and other harsh Environments. GreenTape™ 951 is designed for use as an insulating layer in a wide variety of applications such as multichip modules, single chip packages, ceramic printed wiring boards, and RF modules.

Tape Reference Thickness Datasheet Tape reference Thickness Datasheet

GreenTape™ 951PT

114.3 μm (4.5 mils)

GreenTape™ 951PX

254 μm (10 mils)

GreenTape™ 951P2

165.1 μm (6.5 mils)

GreenTape™ 951C2

50.8 μm (2 mils)

Thick film pastes system for the Green Tape™ 951

Gold System Silver System Mixed System
Conductors

5740A

6142D

Signal Lines – inner + layer

5742

6145R

Signal Lines – top layer –interconnect

5740A

6148

Ground Planes

6142D

Capacitor Electrodes

6118A

Platable AuNi

Via Fills

5738R

6141R

Via Fill

TC701 (Au) /
6138R (PdAg)

Outer Transition Via (to Au or PdAg)

Bonding & Soldering

5742

5742

Au Wire Bonding (Co Fired) Thin Al Wire

6146

Heavy Al Wire Bonding (Co Fired)

5739

6146

Solderable (Co Fired)

4597R

LF172

Solderable (Post Fired)

Brazing

5062S

5081R

Adhesion Layer

5063R

5082R

Barrier Layer

Resistors

CF011 / CF021 /
CF031 / CF041

Cofired

Overglaze

QQ550

Post-Fired 500°C

9615R

Sequential & Cofired 850°C

Green Tape™ 9K7 - Low Loss Tape

Green Tape™ 9K7 was developed for high frequency applications – up to 100 GHz and beyond – where low loss characteristics are desired.

Tape Thickness Datasheet

Green Tape™ 9K7V

127 μm (5 mils), 254 μm (10 mils)

Green Tape™ 9K7X

127 μm (5 mils), 254 μm (10 mils)

Thick film paste system for Green Tape™ 9K7

Gold System Silver System
Conductors

LL505

Au inner signal & ground plane

LL602

Ag ground internal

LL612

Ag signal internal

Via Fills

LL502

LL601

Via fill

Bonding & Soldering

LL507

Au outer, Au wire bondable

LL509

Au external solderable

4597R 

Pt-Au post fired solderable

4598

Pt-Au post fired solderable

LL627

AgPd solderable co-fired

7484R

AgPd post fired external

Brazing

5062S

5081R

Post fired brazing (adhesion)

5063R

5082R

Au post fired brazing (barrier)

Resistors

HBF12 / HBF22

HBF12 / HBF22

Cofired 20Ω / 200Ω

Overglaze

QQ550

QQ550

Post-Fired 500°C

9615R

9615R

Sequential & Cofired 850°C

Produits et informations additionnelles

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