Micro-électronique - Products - CCI Eurolam

Demander un échantillon

Circuit imprimé Electronique imprimée Circuit céramique Wood & Glass Traitement de surface Gravure chimique Photovoltaïque

DuPont Photoresists

DuPont offers a robust, production-proven photoresist product line for semiconductor manufacturing processes, from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm, from our i-line/g-line, to our 193 and KrF product families, combined with DuPont’s etching, developing and ancillary products.

Permanent Photo-patternable Epoxies & Polymers

Kayaku is a leading provider of photoresist and specialty chemicals for MEMS and Microelectronics, in particular in the field of permanent photo-patternable epoxies and polymers such as: SU-8, KMPR® 1000, PermiNex® Wafer Bonding Adhesives and KMSF®

Kayaku Lift-off Resists

PMGI and LOR high yield, metal lift-off process resists and PMMA (polymethyl methacrylate) versatile polymeric Positive Resists.

Thin film etchants

Transene offers a large range of thin film etchants.

High Purity Wet Chemistry

Technic supplies some of the most advanced solutions for semiconductor fabrication and packaging, including photoresist strippers, cleaners (post etch residue removers), metal etchants, and high purity wet chemistry

Semiconductor Packaging Materials

DuPont develops new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out WLP and TSVs. DuPont is a technology leader in electroplating materials used for UBM, RDL, Cu pillars, and solder bumps, along with polymers and dielectrics for RDL, photoresists and TSV fill.

Semiconductor Assembly

Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future with solders and flux for System-in-Package (SiP), Heterogeneous Integration Assembly (HIA), MEMs assembly, flip chip bonding and BGA ball attach.

Spin-on Dielectrics

Flowable oxide (FOx) spin-on dielectric materials are used to optimize planarization of inter-level dielectrics in multilevel metal integrated circuit (IC) designs. They can be used to significantly improve topside planarity when applied prior to the final passivation step.

WBR Series - Wafer Bumping Dry Film Photoresists

WBR Dry Film Photoresists for Wafer Bumping deliver excellent performance in both photo stencil and electroplating processes, and are available in a range of 50-120 microns thicknesses.

Adhesives

Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...

Wafer handling systems

We offer a large range of wafer handling systems with various sizes, including membrane film boxes and wafer carriers for use in the microelectronics industry.

Electrically conductive adhesives

Electrically conductive adhesives are employed in integrated circuit packaging in order to provide a permanent mechanical connection for joining components and at the same time enabling electrical contact of the components.

Cleanroom supply

Wide selection of cleanroom supplies including Lab Coats, Coveralls, Bouffant Caps, Shoe Covers, Gloves, Tacky Mats, ESD and more.