Semiconductor Assembly

Semiconductor Flip-Chip Fluxes
Indium Corporation produces high-quality, advanced fluxes for flip-chip component assembly, designed to meet the demands of cutting-edge semiconductor devices. These fluxes address common challenges of miniaturization, such as thin or warped substrates and fine-pitch, high I/O count assembly. Indium Corporation offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provides a sustainable, low-residue alternative to traditional water-soluble fluxes.

Semiconductor Fine Powder Solder Pastes

Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics industry. Suitable for a variety of applications, including printing, contact dispensing, and jetting, these pastes are specifically formulated to cater to unique customer requirements. Special attention during flux and powder production ensures that the final product is optimized to effectively tackle manufacturing challenges and increase yields.

AuLTRA® Precision Gold alloy Die-Attach Preforms
Indium Corporation’s gold-based precision die-attach preforms offer superior quality, ensuring optimal performance in critical, high-reliability die-attach applications. Precision die-attach preforms adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness (BLT) control, solder bonding, and thermal transfer.

Thermal Interface Materials
Thermal interface materials (TIMs)—such as TIM1, TIM1.5, or TIM2—play a crucial role in overall system performance. Metal-based TIMs offer the lowest thermal resistance, meet industry reliability standards, and can be customized to suit specific package or system requirements. As the foremost provider of metal-based TIM solutions, Indium Corporation is ready to help you integrate these materials into your products and applications.