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Assembly

Metal TIMs

The dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Indium Corporation is a leader in the development of both solder and metal-based thermal interface materials (TIM) for a wide variety of applications.
Assembly Microelectronics

Semiconductor Assembly

Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future with solders and flux for System-in-Package (SiP), Heterogeneous Integration Assembly (HIA), MEMs assembly, flip chip bonding and BGA ball attach.
Assembly

Solder Paste

As a leader in soldering technology, Indium Corporation offers a number of solder pastes for assembly with many different alloy choices and flux technologies to solve many of your process challenges such as miniaturized components, fine-pitch, voiding, printing and reflow performance.
Assembly

Solder Preforms

Indium Corporation is a world-leader in the design and manufacture of high-quality solder preforms, used in a variety of applications that require precise amounts of solder or flux, such as pin-in-paste, void reduction or uniform bondline . They are and available in various shapes, sizes and alloy, with the possibilty to have flux coating or reinforcement.
Photovoltaics

Solder Ribbons

Indium Corporation is a world-leader in the design and manufacture of high-quality solder preforms, used in a variety of applications. High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional requirements.
Assembly

Solder Wires & Fluxes

Indium Corporation manufactures a broad range of solid and flux-cored solder wire. Available in several diameters, several alloys and high to very low flux %. It manufactures as well a broad range of TacFlux™ and flux pens.
Microelectronics

Thin film etchants

Transene offers a large range of thin film etchants: Al, Al2O3, BOE, Cr, Cr-Si, Cr-SiO, Cu, GaAs, GaN, Ga2O3, GaP, Ge, Au, Hf, HfO, In2O3, ITO, InP, Fe2O3, Polyimide, MgO, Mo, Nb, NbN, NbO, Ni-Cr, Ni, Ni-V, Pd, Pd, Ru, Si, SiC, SiO2, SiO, Si3N4, Ag, Acier inox, Ta, Ta3N5, Ta2O5, TaSi, Sn, SnO, Ti, TiN, Ti-W, W, SnO

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