Coating measurement

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At each step of your process, Hitachi brings solutions to control and increase security of your processes and products.

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CMI95: Identifying copper thickness
	Identify or measure Copper foil thickness fast and accurately before starting manufacturing process Micro resistance method: Unlike other test methods, it is not affected by Copper coating on the opposing side of the printed circuit board. Only available handheld gauge that measures the entire range of Copper foil thicknesses from 5 to 140 µm Exclusive soft touch probe to prevent the Copper surface from being marred or scratched Proven durability and simple to use Factory calibrated and requires no standards
CMI165: Measuring copper thickness
	Micro resistance method: allows accurate measurement without being affected by Copper coating on the opposing side of the PCB. Enable to measure Copper thickness on plain surface and even on PCB tracks
CMI511: Measuring plated thru-hole copper prior to and after etching
	Portable gauge capable of measuring plated thru-hole Copper prior to and after etch. Automatic temperature compensation allows for accurate measurement of plated thru-hole Copper immediately after pulling from the tank Works equally well on double-sided and multi-layer boards, even through tin and tin/lead resist High and low limits can be set and up to 2000 readings can be stored in memory
CMI760: Controlling the final product
	Measures plated thru-hole Copper prior to and after etch. Measures Copper thickness on the surface (tracks) – with SRP probe Measures thickness of Nickel (even through Gold coating) – with NIP probe Measures thickness of soldermask – with ECP probe