The DuPont™ Green Tape™ 951 low temperature co-fired ceramic (LTCC) material system combines the benefits of multilayer co-fired ceramic and thick film technologies to meet the increasing demand for reliable electronics functioning in extreme heat and other harsh Environments.

Green Tape™ 951
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951PT   114.3 µm (4.5 mil)
  952P2   165.1 µm (6.5 mil)  
  952P2   254 µm (10 mil)  
  952P2   50.8 µm (2 mil)  
Gold system
Silver system
Mixed system


6142A 6142D Signal Lines
 5742 6145R  6145R Signal Lines  
  6142D  6742D Signal Lines (RF cond)
 5740A 6148  6148 Ground Planes  
  6142D  6142D Capacitor Electrodes
 Via Fills    5738R 6141R  6141R Via Fill
  6138R  6138R Outer Via (to Au or PdAg)
Bonding & Soldering
5742    5742 Au Wire Bonding (Co Fired)  
5742    5742 Thin Al Wire Bonding (Co Fired)
  6146  6146 Heavy Al Wire Bonding (Co Fired)
5739 6146   6146 Solderable (Co Fired)
4597/4598Y LF172 LF172 Solderable (Post Fired)  
Brazing  5062S 5081R tba Adhesion Layer
5063S 5082R tba Barrier Layer  
Resistors CF011 / CF021 / CF031 / CF041
Overglaze    QQ550   Post-Fired 500 °C
  9615R   Sequential Cofired




Green Tape™ 9K7 was developed for high frequency applications - up to 100 GHz and beyond - where low loss characteristics are desired.

Green Tape™ 9K7 / Low Loss Tape
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Tape   9K7V, 9K7X
  127 µm (5 mil), 254 µm (10mil)  
Gold system
Silver system


    Au inner signal & ground plane  
  LL602   AG ground internal  
  LL612   AG signal internal
Via Fills LL502 LL601   Via Fill  
Bonding & Soldering
LL507     Au outer, Au wire bondable  
LL509     Au external solderable  
 4597R/4598     Pt-Au post fired solderable  
  LL627   AGPd solderable co-fired  
  7484R   AGPd post fired external  
Brazing 5062S 5081R   post fired brazing (adhesion)  
5063S 5082R   Au post fired brazing (barrier)
Resistors HBF12/HBF22
Cofired 20Ω / 200Ω
Overglaze   QQ550   Post-Fired 500 °C  
  9615R   Sequential & Cofired 850 °C  


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