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PCB final finishes

Muster anfordern

ENIG, ENEPIG, Tin and SnPb high performing PCB latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer process costs, while maintaining optimum reliability and performance.

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Tin & Tin-Lead plating and stripping

Tinposit™ Immersion Tin is a tin deposition product, which produces uniform, smooth tin deposits on copper and copper-based alloys by an immersion reaction. Ronastan™ is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™  deposits are designed for use as etch resists in the manufacture of PCBs, with excellent throwing power and metal distribution, even in high-aspect through holes and microvias.

Type Deposit Designation Features

Electrolytic

Tin plating

RONASTAN EC

Sulfuric base

Electroless

Tin deposit

TINPOSIT

Electrolytic

SnPb (60/40) plating

SOLDERON PC

high stability of the alloy, very high distribution, MSA-base

Tin Stripper

ENVIROSTRIP™ 785

High efficency one step stripper

Tin Stripper

RONASTRIP TL85

Nitric acid free

Nickel, Gold & Palladium deposit

Aurolectroless™ Immersion Gold and Duraposit™ Electroless Nickel from DuPont Electronic Solutions are designed to lower board manufacturer’s ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless Nickel and Palladium.

Type Deposit Designation Features

Electroless

ENIG: Nickel – Gold

RONAMAX SMT

Electroless

ENIG: Nickel – Gold

Duraposit™ SMT 88

Improved corrosion resistance

Electroless

Palladium

PALLAMERSE

Electroless

ENEPIG: Ni – Pd – Au

AUROLECTROLESS

High stability, low gold concentration & EDTA-free versions

Electrolytic

Nickel-Gold

NIKALPC3 + AURONAL BGA

Weitere Produkte und Informationen

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