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PCB final finishes

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ENIG, ENEPIG, Tin and SnPb high performing PCB latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer process costs, while maintaining optimum reliability and performance.

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Tin & Tin-Lead plating and stripping

Tinposit™ Immersion Tin is a tin deposition product, which produces uniform, smooth tin deposits on copper and copper-based alloys by an immersion reaction. Ronastan™ is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™  deposits are designed for use as etch resists in the manufacture of PCBs, with excellent throwing power and metal distribution, even in high-aspect through holes and microvias.

Type Deposit Designation Features

Electrolytic

Tin plating

RONASTAN EC

Sulfuric base

Electroless

Tin deposit

TINPOSIT

Electrolytic

SnPb (60/40) plating

SOLDERON PC

high stability of the alloy, very high distribution, MSA-base

Tin Stripper

ENVIROSTRIP™ 785

High efficency one step stripper

Tin Stripper

RONASTRIP TL85

Nitric acid free

Nickel, Gold & Palladium deposit

Aurolectroless™ Immersion Gold and Duraposit™ Electroless Nickel from DuPont Electronic Solutions are designed to lower board manufacturer’s ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless Nickel and Palladium.

Type Deposit Designation Features

Electroless

ENIG: Nickel – Gold

RONAMAX SMT

Electroless

ENIG: Nickel – Gold

Duraposit™ SMT 88

Improved corrosion resistance

Electroless

Palladium

PALLAMERSE

Electroless

ENEPIG: Ni – Pd – Au

AUROLECTROLESS

High stability, low gold concentration & EDTA-free versions

Electrolytic

Nickel-Gold

NIKALPC3 + AURONAL BGA

Additional products and information

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