Passive Component Materials

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Micromax materials enable tighter tolerance and performance of smaller chip components, as well as high precision and robustness for more complex and demanding applications such as automotive, infrastructure, etc.

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Chip Resistor

Micromax resistive materials feature:

          • Wide process window including firing temperture and resistor size
          • Tight resistivity and TCR control on small chip sizes
          • Excellent power handling performance
          • Electrostatic discharge
          • Anti-sulfuration conductors
          • Polymeric conductor options
          • Lead-free systems

Resistor Series

Resistor Series Features

00x1Z/00×1

Enhanced power handling (ESD, STOL)
Higher yield at laser trimming
Optimized printability for small chip sizes
Designed for <0.5mm sq resistor geometry with 7µm fired thickness

0FxxA/0FxxE

Lead free* resistor series
Designed for <0.5mm sq resistor geometry with 6µm fired thickness

Conductors & Encapsulants for Chip Resistor

C1 Conductor Features Composition Firing temperature

5421E

Lead free standard C1
Platable

Ag/Pd (0.5%)

850°C

5465

Lead free lower cost
Platable

Ag/Pd

850°C

5463

Lead free low cost
Platable

Ag

850°C

5424E

Lead free specialty C1
Platable

Ag/Pd (2%)

850°C

5418

Lead free specialty C1
Platable
Blendable with 5421E

Ag/Pd (18%)

850°C

C2 Conductor Features Composition Firing / Curing temperature

5402E

Lead free
Platable
Dipping

Ag

600°C

5430E

Lead free
Platable
Screen printing

Ag

600°C

5450T

Lead free
Platable
Dip & roller coat

Ag

200°C

Encapsulant Features Color Firing / Curing temperature

5477

Lead free
Fired G1

Green

600°C

5499

Lead free
Polymer G2

Black

180°C

5499A

Lead free
Polymer G2

Black

180°C

5436F

Lead free
Fired G2

Black

620°C

Multilayer Capacitor

Micromax Multilayer Capacitor materials provide:

          • Excllent green strenght, solderability and adhesion
          • Dip cosmetics
          • Platable materials which do not require tumbling or burnishing
Polymer termination Composition Coating method Curing temperature

8452

Ag

Dipping

200°C

8453

Ag

Dipping

200°C

8455

Ag

Roller Coating

200°C

Fired termination Composition Coating method Firing temperature

1187

 

Ag
Platable

Dipping

800°C

4899R

 

Ag
Solderable

Dipping

850°C

4999

Ag/Pd
Solderable

Dipping

710-750°C

Tantalum Capacitor

Micromax Tantalum Capacitor materials provide:

          • Low ESR
          • Uniform thin thickness at chip corners
          • Low cure temperature
Product Composition Coating method Curing temperature

7775

Ag
Thermoplastic

Dipping

160°C

5262L

 

Ag
Thermoset

Dipping

200-220°C

7252

Graphite

Dipping

180°C

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.

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