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Passive Component Materials

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Micromax materials enable tighter tolerance and performance of smaller chip components, as well as high precision and robustness for more complex and demanding applications such as automotive, infrastructure, etc.

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Chip Resistor

Micromax resistive materials feature:

          • Wide process window including firing temperture and resistor size
          • Tight resistivity and TCR control on small chip sizes
          • Excellent power handling performance
          • Electrostatic discharge
          • Anti-sulfuration conductors
          • Polymeric conductor options
          • Lead-free systems

Resistor Series

Resistor Series Features

00x1Z/00×1

Enhanced power handling (ESD, STOL)
Higher yield at laser trimming
Optimized printability for small chip sizes
Designed for <0.5mm sq resistor geometry with 7µm fired thickness

0FxxA/0FxxE

Lead free* resistor series
Designed for <0.5mm sq resistor geometry with 6µm fired thickness

Conductors & Encapsulants for Chip Resistor

C1 Conductor Features Composition Firing temperature

5421E

Lead free standard C1
Platable

Ag/Pd (0.5%)

850°C

5465

Lead free lower cost
Platable

Ag/Pd

850°C

5463

Lead free low cost
Platable

Ag

850°C

5424E

Lead free specialty C1
Platable

Ag/Pd (2%)

850°C

5418

Lead free specialty C1
Platable
Blendable with 5421E

Ag/Pd (18%)

850°C

C2 Conductor Features Composition Firing / Curing temperature

5402E

Lead free
Platable
Dipping

Ag

600°C

5430E

Lead free
Platable
Screen printing

Ag

600°C

5450T

Lead free
Platable
Dip & roller coat

Ag

200°C

Encapsulant Features Color Firing / Curing temperature

5477

Lead free
Fired G1

Green

600°C

5499

Lead free
Polymer G2

Black

180°C

5499A

Lead free
Polymer G2

Black

180°C

5436F

Lead free
Fired G2

Black

620°C

Multilayer Capacitor

Micromax Multilayer Capacitor materials provide:

          • Excllent green strenght, solderability and adhesion
          • Dip cosmetics
          • Platable materials which do not require tumbling or burnishing
Polymer termination Composition Coating method Curing temperature

8452

Ag

Dipping

200°C

8453

Ag

Dipping

200°C

8455

Ag

Roller Coating

200°C

Fired termination Composition Coating method Firing temperature

1187

 

Ag
Platable

Dipping

800°C

4899R

 

Ag
Solderable

Dipping

850°C

4999

Ag/Pd
Solderable

Dipping

710-750°C

Tantalum Capacitor

Micromax Tantalum Capacitor materials provide:

          • Low ESR
          • Uniform thin thickness at chip corners
          • Low cure temperature
Product Composition Coating method Curing temperature

7775

Ag
Thermoplastic

Dipping

160°C

5262L

 

Ag
Thermoset

Dipping

200-220°C

7252

Graphite

Dipping

180°C

*Lead "free" as used herein means that lead is not an intentional ingredient in and is not intentionally added to the referenced product. Trace amount however might be present.

Additional products and information

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