Riston® Dry films

Muster anfordern

DuPont™ Riston® dry film photoresist revolutionized the way PCBs were fabricated when invented by DuPont 40 years ago. The original dry film photoresist is the industry standard for high yield, productivity, and ease of use in all imaging applications, including the latest industry demands for finer features, higher quality and lower cost in all types of plating and etching applications as well as LDI exposure.

Haben Sie eine Frage? Kontaktieren Sie uns

Riston® T 200 series

Robust film for all applications

Name Etching environment Thickness µm PDF

T 215

Acid and alkaline etching, plating

38

T 220

Acid and alkaline etching, plating

50

Riston® ES 100 series

High productive resist for rapid exposure, development and stripping and fine line innerlayer performance

Name Etching environment Thickness µm PDF

ES 102

Acid etching

30

ES 140

Acid etching and Cu, Sn plating

38

ES 150

Acid etching and Cu, Sn plating

50

Riston® EM 930 EtchMaster series

High productive resist for rapid exposure, development and stripping and fine line innerlayer performance

Name Etching environment Thickness µm PDF

EM 930

Acid etch

30

Riston® PM 200 Plate Master series

Excellent tenting and plating resist with increased flexibility and productivity

Name Etching environment Thickness µm PDF

PM 240

Acid etching, Plating

38

PM 250

Acid etching, Plating

50

PM 275

Plating (Cu, Sn, SnPb)

75

Riston® MM 100 MultiMaster series

General purpose resist with strong performance in high pH alkaline etching and aggressive gold plating environment simplifies the manufacturing operation by eliminating the need for different films in your production line

Name Etching environment Thickness µm PDF

MM 140

High pH alkaline etching and aggressive gold plating

38

MM 150

High pH alkaline etching and aggressive gold plating

50

Riston® MM 700 MultiMaster series

Robust resist with wide developing process window. Suitable for both conventional and LDI exposure (355nm)

Name Thickness µm PDF

 MM 740

Acid and alkaline etching and Plating (inc Gold)

40

Riston® LDI 7000/7200 Laser series

Very high photospeed resists for laser direct imaging

Name Etching environment Thickness µm PDF

LDI 7030

Acid and alkaline etching, plating

30

LDI 7040

Acid and alkaline etching, plating

38

LDI 7250

Acid and alkaline etching, plating

50

LDI 7262

Acid and alkaline etching, plating

62

LDI 7275

Acid and alkaline etching, plating

75

LDI 7299

Acid and alkaline etching, plating

100

Riston® FX 900 Special series

Designed to produce the new, high resolution innerlayers demanded for the leading edge PCBs. Excellent flow during lamination

Name Etching environment Thickness µm PDF

FX 920

Acid etch

20

FX 930

Acid and alkaline etch

30

FX 940

Acid etch, Plating Cu, SnPb

40

FX 950

Acid etch, Plating Cu, SnPb

50

Riston® GM 100 Gold Master series

Thick plating film for selective Ni/Au plating and chemical milling

Name Etching environment Thickness µm PDF

GM 130

Vacuum Lamination, Ni/Au Plating and Chemical Milling

75

GM 140

Vacuum Lamination, Ni/Au Plating and Chemical Milling

100

Riston® FX 250 Special series

Speciality product tough enough to stand up to harsh selective metalization processes, such as electroless nickel immersion gold (ENIG)

Name Etching environment Thickness µm PDF

FX 250

ENIG and electrolytic Ni/Au plating

50

Riston® DI3000 Dry Film Photoresist for Multi-layered Boards

Next Generation T/E and P/E direct imaging photoresist. Excellent tenting, chemical resistance and wind operation window enable higher yield.

Features:

  • Superior tenting capability
  • Excellent chemical resistance with no ragged line
  • Wide operation window by fine line capability
  • Capable with i-line & h-line multiple wavelength DI equipment
  • Low sludge/foaming for easy maintenance

Haben Sie eine Frage?

Wenn Sie Hilfe benötigen oder Fragen zu unserem Unternehmen oder unseren Produkten haben, zögern Sie bitte nicht, uns zu kontaktieren.

*“ zeigt erforderliche Felder an

Land*
Dieses Feld dient zur Validierung und sollte nicht verändert werden.