Metallization chemistry for 3D Molded Interconnect Device (MID) technology
DuPont Electronic Solutions compliments its range of photo imageable products with a wide range of supporting products for developing, etching and stripping processes.
ImageMaster™ Diazo Phototooling Films are suited for making high-quality phototools that are scratch and chemical resistant for use in exposing liquid and dry film photoresists (including solder masks) employed in the manufacture of printed wiring boards.
Pyralux® and Nikaflex® flexible laminates, coverlay, adhesive and Bondply adhesiveless, acrylic and epoxy-adhesive
Unlike many nonwoven fabrics, Sontara® uses no binders, chemicals or adhesives. It has exceptional mechanical strength, excellent absorbency, and because the fibers are washed during fabric formation, it exhibits very low lint.
DuPont electrolytic copper plating and via filling advanced chemistry
Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
DuPont Photoposit™ range of negative and positive liquid photoresists enable uniform thin coatings for improved surface conformance, fine-line etching performance, as well as lower costs and reduced waste.
DuPont longstanding expertise in electroless copper plating solutions
ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.