Surface treatment processes

 

  Designation Description

DEVELOPER - STRIPPER:

Developer RESOLVE 9033R - highly concentrated dry film and solder mask developer
- high yields
Stripper SURFACESTRIP419 - high stripping speed
- no oxidation to optimize AOI
SURFACESTRIP715 - excellent stripping performance into small particules
- requires a cyclone filter

INNER LAYER BONDING:

Oxydation brown CIRCUBOND 2200 Uniform dark brown aspect
Oxydation black PROBOND 80 Black aspect - vertical or horizontal utilisation

DESEMEAR:

Conditionner CIRCUPOSIT HOLE PREP 3304 Standard
  CIRCUPOSIT HOLE PREP 4126 Multi purpose, high and low TG
Promoter CIRCUPOSIT PROMOTER 3310/4140 Standard vertical
  CIRCUPOSIT PROMOTER 4130 More agressive, better penetration, in small holes
Neutraliser CIRCUPOSIT NEUTRALIZER 3314 Permanganate neutraliser
  CIRCUPOSIT 3319 Neutraliser and conditionner

MAKING HOLE CONDUCTIVE:

Thin or thick copper CIRCUPOSIT 3350-1 - auto accelerated
- excellent adhesion on a wide range of substrates
Thin copper CUPOSIT 328Qi - EDTA free, Mercuey free
- excellent adhesion and coverage on a wide range of substrates ranging from FR4, Kapton, Polyimid to Teflon based laminates
+ Flash copper COPPER GLEAM HT55 Excellent elongation and penetration
+ Via filling MICROFILL EVF Blind vias 100 µm dia x 60 µm deep, 12 µm surface copper
- thin copperplating (20 µm)
- through hole and blind via
- high ductility
- insoluble anode
Direct metalisation CONDUCTRON Vertical or horizontal

COPPER PLATING:

Pulse COPPER GLEAM PPR High productivity
COPPER GLEAM CUPULSE High aspect ratio (~15)
Direct COPPER GLEAM PC and CLX Simplicity of analysis and control
COPPER GLEAM HT55 Excellent distribution and elongation
COPPER GLEAM HGX Very high ductility, flex circuits, soft materials
Via fill MICROFILL EVF Small holes and blind vias

TIN AND TIN-LEAD PLATING AND STRIPPING:

Tin   RONASTAN EC Sulfuric base
SnPb (60/40) SOLDERON PC - high stability of the alloy
- very high distribution
- base acid MSA
Stripper ENVIROSTRIPTM 785 High efficency one step stripper

ELECTROLESS FINISHES:

ENIG
Nickel - Gold

Ni RONAMAX SMT
DURAPOSIT SMT88 Higher % for improved corrosion resistance 

ENEPIG
Ni - Pd - Au

Au AUROLECTROLESS - low gold concentration version
- EDTA free version
- high stability

OTHER FINISHES:

Electrolytic Ni/Au NIKALPC3 + AURONAL BGA Bonding, connectors
Sn/Pb (60/40) SOLDERON PC

 

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