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Making hole conductive

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DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of high density pcb including rigid-flex . DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

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Circuposit™ Desmear

Circuposit™ desmear process results from DuPont long expertise in a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage. This process defines a new standard for via plating. The serie contains products formulated to process both traditional FR-4 type laminates and more advanced high Tg materials.

Designation Description

Sweller

CIRCUPOSIT HOLE PREP 4120

Standard

Sweller

CIRCUPOSIT HOLE PREP 4126

Multi purpose, high and low Tg

Promoter

CIRCUPOSIT PROMOTER 3310/4140

Standard vertical

Promoter

CIRCUPOSIT PROMOTER 4130

More agressive, better penetration in small holes. Soluble at 20°C. Sodium Permanganate based.

Neutraliser

CIRCUPOSIT NEUTRALIZER 3314

Permanganate neutraliser

Neutraliser

CIRCUPOSIT 3319-1

Neutraliser and conditionner

Making hole conductive

Type Name Description
Electroless Copper chemistry

Conditionner

Large range of advanced conditionning chemistry for all type of materials and Tg.

Thin copper

CUPOSIT 328Qi

  • EDTA free, Mercury free
  • Excellent adhesion and coverage on a wide range of substrates ranging from
    FR4, Kapton, Polyimid to Teflon based laminates

Thin or thick copper

CIRCUPOSIT 3350-1

  • auto accelerated
  • excellent adhesion on a wide range of substrates
Direct metallisation

Palladium based

CRIMSON

Excellent stability and versatility

Conductive carbon

GRAPHITE 2000

Additional products and information

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