Products PCB Basematerial Arlon Hi-Rel PI & no-flow Arlon Hi-Rel PI & no-flow Request a sample Founded in 1969 in Southern California, Arlon EMD is a leading manufacturer of specialty high performance laminate and prepreg materials for use in printed circuit board applications across demanding and diverse markets. Have a question? Get in touch Medical Satellite Avionics Defense Polyimide Products Resin Product description Tg °C Type/ IPC-4101 UL-94 Fabric Comments Datasheet Process Guide 33N Kerimid 701 (V0) Non-MDA Polyimide 250 GIL /40; 41 V-0 E Maximum Flame Retardance 35N Kerimid 701 (V1) Non-MDA Polyimide 250 GIL /40; 41 V-1 E Drilling enhanced 37N Low-flow polyimide Prepreg 200 GIJ /42 N/A E Rigid Flex 38N Low-flow polyimide Prepreg 200 GIJ /42 N/A E Rigid Flex 84N Multifilm Hole-Fill Prepreg 250 GIL /40; 41 N/A E Filled 85N 84HP high-performance ceramic-filled polyimide >250 GIL /40; 41 HB 85HP High Performance Polyimide >250 GIL /40; 41; E-appx. A Meets HB E Tc (W/mK) is 2x Polyimide 85N Non-MDA Polyimide – Unmodified 250 GIL /40; 41 HB E Maximum Thermal Stability HF-50 Hole-Fill Compound 250 N/A N/A None Fill Clearance Holes 86HP Anti CAF/Low Dk/Df Polyimide 250 GIL/40; 41 V-0 E Up to 7 laminations Epoxy & Low-flow Products Resin Product description Tg °C Type/ IPC-4101 UL-94 Fabric Comments Datasheet Process guide 45N Multifunctional Epoxy 170 GFG /24 V-0 E High Layer Count MLB´s 47N Low-flow Tetrafunctional Epoxy Prepreg 130 GFG /23 V-0 E Rigid Flex, Heat Sinks 49N Low-flow Multifunctional Prepreg 170 GFG /24 V-0 E Rigid Flex, Heat Sinks 51N Low-flow lead-free 170 GFG /124 V-0 E Lead free soldering Controlled Thermal Expansion Resin Product description Tg °C Type/ IPC-4101 UL-94 Fabric Comments Datasheet Process guide 55NT Multifunctional Epoxy/ non woven aramid 170 BFG /55 V-0 B CTE = 7-8 ppm/°C 85NT Polyimide/ non woven aramid 240 BIL /53 N/A B CTE = 7-9 ppm/°C
