COVID-19. Our group has taken safety measures such as strict rules for hygiene, social distancing, cancelling travels and home office to all function whenever possible. Learn more

Rogers Prepregs & Bondply

Request a sample

Rogers' Advanced Connectivity Solutions (ACS) business manufactures leading high frequency laminates, bondplys and prepregs, engineered to meet stringent performance requirements and exceptional dielectric constant control. ACS Materials are a consistent and reliable choice for applications including 5G wireless communication, automotive radar sensors, aerospace, satellites and more.

Have a question? Get in touch

Bonding Materials

Product Material Type Glass Type Dk (10 GHz) Df (10 GHz) CTE (X/Y/Z)ppm/°C UL94 H²O Absorp Tc (W/ m-K) Datasheet

92ML™ Prepreg

5.3 (1MHz)

0.011 (1MHz)

18/18/27

V-0

0.12

1.60

2929 Bondply

2.94 ±0.05

0.0030

50/50/50

0.1

0.40

Coolspan® TECA film

Thermally & Electrically
Conductive Thermoset Adhesive

N/A

N/A

45/45/45

N/A

6.00

6250 Bonding Film

2.32

0.0013

-/-/-

0.01

0.17

6700 Bonding Film

2.35

0.0025

-/-/-

0.01

0.17

RO4460G2™

Hydrocarbon/Ceramic

Woven/Prepreg

6.15±0.15

0.0040

15/18/43

V-0

0.13

0.67

RO4450T™

Hydrocarbon/Ceramic

Woven/Prepreg

3.32 ±0.05

0.0039

20/21/57

V-0

0.11

0.50

RO4450F™

Hydrocarbon/Ceramic

Woven Prepreg

3.52 ±0.05

0.0040

19/17/50

V-0

0.09

0.65

Xtreme Speed™ RO1200™ Bondply

2.97

0.0012

15/15/35

V-0

0.13

0.5

SpeedWave™ 300P Prepreg

3.16

0.0021

15/15/35

V-0

0.12

0.48

Additional products and information

Have a question?

If you need any assistance or have queries regarding our company or products, please do not hesitate to contact us.
  • This field is for validation purposes and should be left unchanged.