Circuiti Stampati Metallizzazione Electrolytic copper plating DuPont electrolytic copper plating and via filling advanced chemistry
Circuiti Stampati Metallizzazione Making hole conductive DuPont longstanding expertise in electroless copper plating solutions
Trattamento superficiale Metal deposition & finishing Gold, Copper, Silver, Nickel, Chrome, Bronze, Ruthenium, Palladium, Tin and various alloys plating processes and finishing.
Circuiti Stampati Macchinari Metallizzazione Trattamento superficiale PAL Vertical Plating Lines PAL designs and supplies custom-built plating equipment for PCB, semiconductor and general metal finishing applications throughout the world.
Circuiti Stampati Metallizzazione PCB final finishes ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.
Circuiti Stampati Imaging Peters ELPEPCB Coatings Peters, a global leader in the field of electronics-related high-tech coatings, offers the complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing from solder masks to marking inks.
Trattamento superficiale Plating on Plastic High-performing, Environmentally-friendly Metal Plating on Plastic Surfaces processes.
Macchinari Trattamento superficiale Precious metal recovery Recovery of precious metals in your metallization baths as well as in your static rinses by electrolysis.
Circuiti Stampati Imaging Chemical Milling Riston® Dry films DuPont™ Riston® dry film photoresists for high yield, productivity, ease of use, finer features, higher quality and lower cost in all types of plating and etching applications as well as LDI exposure.
Microelectronics Semiconductor Packaging Materials DuPont develops new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out WLP and TSVs. DuPont is a technology leader in electroplating materials used for UBM, RDL, Cu pillars, and solder bumps, along with polymers and dielectrics for RDL, photoresists and TSV fill.