Arlon Hi-Rel PI & no-flow

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Founded in 1969 in Southern California, Arlon EMD is a leading manufacturer of specialty high performance laminate and prepreg materials for use in printed circuit board applications across demanding and diverse markets.

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Polyimide Products

Resin	Product description	Tg °C	Type/ IPC-4101	UL-94	Fabric	Comments	Datasheet	Process Guide
33N	Kerimid 701 (V0) Non-MDA Polyimide	250	GIL /40; 41	V-0	E	Maximum Flame Retardance
35N	Kerimid 701 (V1) Non-MDA Polyimide	250	GIL /40; 41	V-1	E	Drilling enhanced
37N	Low-flow polyimide Prepreg	200	GIJ /42	N/A	E	Rigid Flex
38N	Low-flow polyimide Prepreg	200	GIJ /42	N/A	E	Rigid Flex
84N	Multifilm Hole-Fill Prepreg	250	GIL /40; 41	N/A	E	Filled 85N
84HP	high-performance ceramic-filled polyimide	>250	GIL /40; 41	HB
85HP	High Performance Polyimide	>250	GIL /40; 41; E-appx. A	Meets HB	E	Tc (W/mK) is 2x Polyimide
85N	Non-MDA Polyimide – Unmodified	250	GIL /40; 41	HB	E	Maximum Thermal Stability
HF-50	Hole-Fill Compound	250	N/A	N/A	None	Fill Clearance Holes
86HP	Anti CAF/Low Dk/Df Polyimide	250	GIL/40; 41	V-0	E	Up to 7 laminations

Epoxy & Low-flow Products

Resin	Product description	Tg °C	Type/ IPC-4101	UL-94	Fabric	Comments	Datasheet	Process guide
45N	Multifunctional Epoxy	170	GFG /24	V-0	E	High Layer Count MLB´s
47N	Low-flow Tetrafunctional Epoxy Prepreg	130	GFG /23	V-0	E	Rigid Flex, Heat Sinks
49N	Low-flow Multifunctional Prepreg	170	GFG /24	V-0	E	Rigid Flex, Heat Sinks
51N	Low-flow lead-free	170	GFG /124	V-0	E	Lead free soldering

Controlled Thermal Expansion

Resin	Product description	Tg °C	Type/ IPC-4101	UL-94	Fabric	Comments	Datasheet	Process guide
55NT	Multifunctional Epoxy/ non woven aramid	170	BFG /55	V-0	B	CTE = 7-8 ppm/°C
85NT	Polyimide/ non woven aramid	240	BIL /53	N/A	B	CTE = 7-9 ppm/°C