PCB
Metallisierung
Oberflächenbehandlung
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Leistungselektronik
Conductors
Micromax™ has a broad offering of conductors including Platinum, Silver and gold-based alloys (Pd and Pt) conductors
Mikroelektronik
DuPont Photoresists
DuPont offers a robust, production-proven photoresist product line for semiconductor manufacturing processes, from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm, from our i-line/g-line, to our 193 and KrF product families, combined with DuPont’s etching, developing and ancillary products.
PCB
Reinigung
DuPont™ Sontara® Wipes
Unlike many nonwoven fabrics, Sontara® uses no binders, chemicals or adhesives. It has exceptional mechanical strength, excellent absorbency, and because the fibers are washed during fabric formation, it exhibits very low lint.
PCB
Metallisierung
Electrolytic copper plating
DuPont electrolytic copper plating and via filling advanced chemistry
PCB
Bildübertragung
Metallisierung
Entwickler, Stripper & Hilfsmittel
DuPont Electronic Solutions ergänzt sein Angebot an bildgebenden Produkten durch eine breite Palette von Produkten für Entwicklungs-, Ätz- und Strippprozesse.
PCB
Bildübertragung
Chemisches Formätzen
Flüssiger Photoresist
DuPont Photoposit™ Flüssigphotoresists in Negativ- und Positivausführung ermöglichen gleichmäßig dünne Beschichtungen für eine verbesserte Oberflächenkonformität und Feinätzleistung sowie geringere Kosten und weniger Abfall.
Oberflächenbehandlung
Gold & Gold-alloys deposition
Pure Gold and various alloys: Au/Co, Au/Cu (2N, 3N, 5N), Au/Cu/Cd, Au/Ni, Au/Ag for decorative and Technical applications (Wire bonding)
PCB
Metallisierung
Inner layer bonding
Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
PCB
Metallisierung
Making hole conductive
DuPont longstanding expertise in electroless copper plating solutions
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