Partners
Hi-Performance copper clad laminates and prepregs
Flexible polyimide laminates, coverlays & adhesives
High Reliability PI & no-flow
Microwave and thermally conductive laminates and prepregs
FR2, CEM-1, FR4 and copper
PCB & GMF surface treatment chemistry and photoresist
Silver film, jettable ink and chemistry
Lamination enhancement products and technologies
Copper Aluminium Copper Copper Steel Copper
Copper foils
Copper foils
Resistive foils
Solid tungsten carbide drills and routers
High performance entry and backup material
Pressing tools, register pins and release agents
Contamination control adhesive materials
Printed electronics inks and thick film pastes
Functional ceramic materials for Aluminium Nitride substrate
Piezoelectric electroactive polymers
Dry electrodes and adhesives
Solamet® PV metallization paste
Technical cleaning
Coating measurement equipment
Soldering paste, preforms, wires, fluxes & TIMs
Resist & ancillary for microelectronics
Soldermask, conformal coating & casting compounds
Semiconductor lithography & packaging materials
Thin film etchants
High purity chemistry
Specialty adhesive for electronics
Printed electronics inks and thick film pastes
Horizontal wet processing equipment
Laminators and spray coaters
Presses & coating technologies
Contamination control adhesive materials
Laser drilling equipment
Vertical wet process lines
Contamination control adhesive materials
Pump and filtration systems
Hot Air Solder Leveler
Coating measurement equipment