PCB Metallization Surface Treatment 3D-MID Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Ceramic Circuit Conductors Micromax™ has a broad offering of conductors including Platinum, Silver and gold-based alloys (Pd and Pt) conductors
PCB Imaging Metallization Developer, Stripper & ancillaries DuPont Electronic Solutions compliments its range of photo imageable products with a wide range of supporting products for developing, etching and stripping processes.
PCB Basematerial DuPont Pyralux® Flexible CCL Pyralux® and Nikaflex® flexible laminates, coverlay, adhesive and Bondply adhesiveless, acrylic and epoxy-adhesive
PCB Cleaning DuPont™ Sontara® Wipes Unlike many nonwoven fabrics, Sontara® uses no binders, chemicals or adhesives. It has exceptional mechanical strength, excellent absorbency, and because the fibers are washed during fabric formation, it exhibits very low lint.
PCB Metallization Electrolytic copper plating DuPont electrolytic copper plating and via filling advanced chemistry
Surface Treatment Gold & Gold-alloys deposition Pure Gold and various alloys: Au/Co, Au/Cu (2N, 3N, 5N), Au/Cu/Cd, Au/Ni, Au/Ag for decorative and Technical applications (Wire bonding)
PCB Metallization Inner layer bonding Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
PCB Imaging Chemical Milling Liquid photoresist DuPont Photoposit™ range of negative and positive liquid photoresists enable uniform thin coatings for improved surface conformance, fine-line etching performance, as well as lower costs and reduced waste.
PCB Metallization Making hole conductive DuPont longstanding expertise in electroless copper plating solutions