DuPont offers a broad selection of hybrid circuit materials to meet the requirements of different substrates, operating environments, temperatures, and metallizations. Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.

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DuPont offers a complete set of conductors covering a broad application spectrum.

Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.

Additional benefits include low noise characteristics (rated up to five times better than those of conventional systems), improved post-laser trim stability (improved by a factor of three), and outstanding durability at high temperatures.

Silver Conductors

Lead free Lead containing Features DTS LF DTS

LF131

6160

Standard 10-15 µm etchable

LS100

Laser structurable

QM14

With blue fugitive dye

6163

With blue fugitive dye

LF231

7740

Thick Printing >30 µm

TM510

Silver sintering paste

Silver/Platinium Conductors

DuPont Ag/Pt conductors offer high solder leaching resistance and good soldering performances.

Lead free Lead containing Ag/Pt ratio Conductivity Features PDF PDF

LF172

QR171

100:1

< 5m Ohm/sq

Alu bondable

5164N

200:1

2,5-3 mOhm/sq

low cost /high performance

9750R

3:1

Severe soldering conditions

THR61

100:1

<7 mOhm/sq

through hole fill

Gold based conductors

Gold conductors are used for high reliability applications owing to their low resisitivity, resistance to metal migration even in harse environments and non oxidation and corrodation properties.

Lead free Lead containing Wire bonding Features Datasheet Datasheet

5785R

5771

Heavy Al & Au wire bondable > 25 µm

compatible with ML (inner & outer layers)

5744R

Wide bonding window with Al & Au <50 µm

Dense fired film

5747

capable of viafilling up to 3 dielectric layers in single print

5780R

QR150 / LS300

Fine Au wire bonding and etching

Fine line features & laser structurable

THR35

Through hole fill

4597R

Solderable PtPdAu

Silver/Palladium Conductors

DuPont Silver Palladium conductors limit the silver migration in harsh envrionment and improve solderability.

Lead free Lead containing Ag/Pd ratio Features Datasheet Datasheet

6130

6:1

General purpose solderable conductor

LF121

7484R

3:1

Dense fired film. Excellent edge adhesion on Alumina and dielectric.

LS200

5:1

Laser structurable

9475R

4093

2.5-3:1

AgPdPt (1% Pt). Bondable

LF181

20:1

via fill burried & surface

Copper conductors

DuPont copper based conductors offer a high conductivity for application where soldering and heavy Alu wires maybe be required with excellent thermal and electrical properties such as Power electronics.

Lead free Lead containing Temperature Features DTS

5915R

Low temp (600 °C)

Solderable and through hole printable

LF911

High temp (900 °C)

Solderable and Ni/Au platable

7732

High temp (900 °C)

optimized for thick print and heavy Alu wire bonding

Platinium conductors

DuPont Platinium conductors are suitable to operate at elevated temperatures and can be used as electrodes for sensors applications.

Lead free Fritt Firing temperature Features Datasheet

9141R

Fritted

800-1000°C

Dense, high TCR

9896R

frittless

1100-1250°C

Thick Printing, bond pad

Produits et informations additionnelles

Lire plus à propos de Hybrid circuits

Lire plus à propos de DuPont conductive paste

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